[반도체공정실험] Characteristic of MOS Capacitor from C-V graph

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[반도체공정실험] Characteristic of MOS Capacitor from C-V graph에 대한 자료입니다.
목차

목 차

1. Purpose

2. Theory

2.1 MOS capacitor
2.1.1 Principal and structure



2.1.2 Flat band condition

2.1.3 Accumulation

2.1.4 Depletion
2.1.5 inversion
2.1.6 Threshold voltage

2.2 Shottky barrier

2.3 C-V graph

2.4 Graph shifting

3. Procedure
3.1 Experimental variables
3.2 Process

RCA cleaning

Oxidation

Deposition of metal

Measure of C-V graph

3.3 Equipment & method
3.3.1 E-beam evaporator
3.3.2 Atomic Layer Deposition

3.3.3 4275A multi-frequency LCR meter


4. Analysing result
4.1 Difference by frequency

(1) 120nm Al2O3

(2) 130nm SiO2

(3)140nm

4.2 Difference by Material


4.3 Difference by Thickness
5. Discussion
5.1 130nm & 140nm Threshold Voltage(VT) calculation

5.2 Ci upward
5.3 overall discussion


6. Role of members
6. Time scheduleTime

7. Reference

본문내용
2.3 C-V graph
The measured MOS capacitance (called gate capacitance) varies with the applied gate voltage.
① Measurement of C-V characteristics
-Apply any DC bias, and superimpose a small (15 mV) ac signal
-Generally measured at 1 MHz (high frequency) or at variable frequencies between 1KHz to 1 MHz
-The dc bias VG is slowly varied to get quasi-continuous C-V characteristics
② C-V characteristics of MOS-capacitor on p- and n-type Si
The C-V data depends on the measurement frequency as well.
[Figure 11] Measured C-V characteristics on an P-type, N-type Si

2.4 Graph shifting
In MOS structure, we should consider non ideal effects when measure the capacitance according to applied voltage. They are 'fixed charge', 'mobile charge', and 'surface states'. When the fixed charge exists in oxide layer, it causes entire curve of graph to shift to the [Figure 12] C-V graph shift by direction of bias
side. These charges are generated by ions came in the process of deposition of oxide layer. When the charges exist in between the substrate and interface, the value of Vfb and C-V curve will shift by amount of the charge divided by Cox of Ci. The amount of shifting decreases as the position of fiexed charges is far from interface on the substrate and shifting will not exist any more when it is located on the interface between metal and interface. Mobile charges has the same effect. But it makes the curve shift toward applied voltage because the movement of charges is determined by applied voltage(-,+). It is known that mobile charges are generated when dielectric material has the impurities such as Na ion.
The term fast interface state refers to the fact that these defects can change their charge state relatively fast in response to changes of the gate bias. As the surface potential in a
참고문헌
7. Reference
-http://ecee.colorado.edu/~bart/book/moseb.htm
-Ben Streetman, Sanjay Banerjee, "Solid State Electronic Device", PEARSON Education Korea, 6th ed., pp.292~313, 2005
-류경국, "Fabrication and Characterization of Metal-Oxide-Semiconductor (MOS) Capacitor", 2006
-http://www.ecse.rpi.edu/ecse_search.html
-http://ceot.ualg.pt/OptoEl/theory/2terminal/
-Brian Chapman, “Glow Discharge Process”, John Wiley & Sons, Inc. (1980)
-Milton Ohring, “The Materials Science of Thin Films”, Academic Press, Inc., Chapter 3,
(1992)
-W. R. Grove, Philos. Trans. R. Soc. London, A142 (1852) 87.
-F. Brown and J. A. Davies, Can. J. Phys., 41 (1963) 844.
-T. M. Buck, “Methods of Surface Analysis”, A. W. Czanderna (ed.), Elsevier Scientific
Publishing Company, Amsterdam, The Netherlands, Chap. 3 (1975) 75.
-P. Sigmund, “Sputtering by Particle Bombardment I”, R. Behrisch (ed.) Topics in Applied
Physics, Springer-Verlag, Berlin, Germany, Vol. 47 (1981) 9.
-G. Gautherin, “Ractivit dans les plasmas”, A. M. Pointu and A. Ricards (eds.), Editions
de Physique, Les Ulis, France (1984) 243.
-Y. Pauleau “Physical Vapor Deposition Techniques I: Evaporation and Sputtering” in
“Advanced Techniques for Surface Engineering”, Edited by W. Gissler and H. A. Jehn,
Kluwer Academic Publishers, (1992)
-W. D. Westwood, in “Physics of Thin Films”, Vol. 14, eds. M. H. Francombe and J. L.
-http://www.tungsten.com/tipsbeam.pdf
-http://en.wikipedia.org/wiki/Electron_beam_physical_vapor_deposition
-http://www.ece.gatech.edu/research/labs/vc/processes/rcaClean.html
-‘Low-K’란무엇일까" - 김윤주 차장 (기술연구소)
-en.wekipedia.org
-http://blog.naver.com/dadarios?Redirect=Log&logNo=50042381491
-"High-k dielectric? Low-k dielectric?" - Jerzy Ruzyllo, Penn State University,
Semiconductor Notes, Note No 1, posted April 15, 2003.
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