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대학레포트
  • [공학] 열분석(Thermal analysis)
    instrument composition -Electric furnace Temperature range: 25°C~1500°C Heat speed : Maximum 200°C/min *Separate Electric furnace and other system like Electronic scale -Because Electric furnace temperature is very high so we need to protect other system. instrument composition -Electric furnace Temperature range: 25°C~1500°C Heat speed : Maximum 200°C/min *N
    2012-08-16 | 3,000원 | 49p | Thermal 열분석 analysis 공학   [공학] 열분석(Thermal analysis)
  • 신소재 공정-Al-Si Alloy
    Background of Experiment □ Al-Si Alloy AI + Si = Al-Si Alloy 1. Low melting point 2. light 3. Large heat capacity 4. Insoluble to each other . . . Result and Analysis - EDS □ Composition Analysis Al, Si is almost insoluble to each other at rsoom temperature. All solid phase will have either 100% Al phase or 100% Si phase.
    2013-06-20 | 2,500원 | 34p | 공정   신소재 공정-Al-Si Alloy
  • [기계공학] 열유체 공학실험(영문)
    analysis provides the elemental composition of the combustible fraction (volatile matter and fixed carbon) in a fuel. This does not include the moisture which is determined by the proximate analysis. Table 1 shows the typical values of moisture, carbon, hydrogen and oxygen contents for wood and di
    2010-11-09 | 1,400원 | 9p | 공학실험 기계공학 열유체 공학 실험   [기계공학] 열유체 공학실험(영문)
  • MDS as a tool for analyzing QOL data
    both descriptive(exploratory) and analytical(confirmatory), are at hand to deal with this issue. Such data reduction methods are needed not only by those developing new assessment instruments, but also by those involved in translations or other modifications of existing instruments or engaged in methodological research, e.g. in a comparative analysis of several different QOL instruments.
    2018-05-17 | 2,000원 | 11p | 기본가정상담목표상담과정   MDS as a tool for analyzing QOL data
  • [재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)
    4. Condition If reflow, IMC layer occurs between the solder ball and substrate. IMC layer's composition changes depending on reflow time. Temperatuer 255℃ Reflow time 1s, 1min, 5min, 10min, 20min Experimental conditions 5. Analysis IMC layer change was observed according to the reflow time.(Reflow time : 1s, 1min, 5min, 10min, 20min). Do refer to
    2011-08-29 | 1,400원 | 8p | BGA IMC Ni Pbfree   [재료분석실험] Studying of IMC morphology, interfacial reaction and joint reliability of Pb-free Sn-Ag-Cu solder on electrolytic Ni BGA substrate(영문)
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