3. Requirements of EUV resist
EUV is highly absorbed by all materials, even EUV optical components inside the lithography tool are susceptible to damage, mainly manifest as observable ablation. Such damage that is associated with the high-energy process of generating EUV radiation is a new concern specific to EUV lithography .
EUVL's shorter wavelength also increases flare, resulting in less
3) The superiority of Ti plate as the substrate of dye-sensitized solar cells
This figure is light irradiation in DSSC's based on (a) metal substrate(Ti, stainless steel) and (b) FTO substrate. In this paper, nano crystalline TiO2 coated on FTO, Ti and stainless steel substrated was applied as a photoelectrode of DSSCs.
In conclusion, the sheet resistance of metal substrate seems to be const
Problem of
original process
There exists under ground Pit as a previous
car-press factory before present establishment.
Moisture resulted from inner underground pit goes up to the factory and results serious faulty of semiconductor component !
Previous solution
Install ventilation fan and emit inner humid air
so that solve the problem.
New solution
Sim
Process Selection Considerations
Selection of an activated-sludge process for BOD removal and nitrification is a function of many considerations including specific site constraints, compatibility with the existing process, compatibility with existing equipment, present and future treatment needs, level of capability of the operating staff, capital costs, and operating cost.
Complete-mix activ
Calculations of the design of each unit operations
Flowrate
Present Average Flowrate = 4220 m3/d
Water use per capita = 4220/15000 = 0.281333 m3/d capita
Population after 10 years = 15000 Χ 1.0310 = 20158.75 ≒ 21000 capita
∴ Average Flowrate = 0.281333 Χ 21000 = 5908 m3/d ≅6000m3/d
Peak Flowrate = 5908 Χ 1.5 = 8862 m3/d ≅9000 m3/d
Screening
Conditions
Cle