(4) Double patterning
The double patterning is divided into four parts, leading with wafer requirements and then two sets of lithographic requirements (Generic Pitch Splitting - Double Patterning Requirements Driven by MPU metal Half-Pitch and Generic Spacer Patterning Requirements - Driven by Flash). The lithography requirements are different for each process; the requirements for pitch splitti
○ PECVD
∙ What is PECVD?
⇒ Radio frequency(RF) is used to induce plasma in the deposition gas.
⇒ This results in a higher deposition rate at relatively low temperatures.
⇒ With the plasma enhanced CVD process is the deposition at temperature around 300℃ allows.
⇒ The temperature will be through encouragement of a plasma with high frequency electric fields triggered.
설계형상의 제품이 제조
⑶ 특수 주조법
① 금형 주조(다이케스팅) : 압력을 가해 제품생산(알루미늄, 동합금)
- 장점 : 정밀, 표면이 아름다움, 조직치밀, 대량/고속생산 얇고 복잡한 형상 가공
- 단점 : 설치가 복잡하고 용융점 높은 금속에 부적당
※예 : 전기기구, 사진기, 타자기, 계산기 부품
patterning is performed in same time.
Metal mask is shifting, and then red, green, blue organic layers are deposited.
This method has a limitation of resolution, because FMM cannot be small enough
to make high resolution display.
Source is located below, thus substrate can droop. This causes bad pixel problem
Organic material can be melted
easily organic solutions
Thus, organic