process
○ Photolithography
PR
SiO2
N-type
Si
N-type
⦁Deposit photoresist on SiO2.
SiO2
N-type
Si
N-type
⦁Expose UV light. The part of unexposed removes because of negative PR.
○ Wet etching
SiO2
N-type
Si
N-type
SiO2
⦁SiO2 that does not have PR is removed by wet etching and also remaini
wet or dry berries capable of holding 250bbls. #25, 26 and 27 were only for wet berries capable of holding 400bbls.
D) De-stoning, De-chaffing and Drying
For the case of wet berries, they were taken directly to three de-chaffing units which could process up to 1,500bbls per hour each. Since there is no need to de-stone wet fruits, these berries were taken to three drying units where they were
processing up to 1500 bbls.) and then go to the dechaffing units. In all, wet berries would be processed through dryer-included system and dry berries would be processed through other machines which frequently made both berries process at the same time through the system.
IV. Milling – Quality Grading
After the berries were destoned, dechaffed and dried they were sent to one of the thr
process, identify the bottleneck area(s). What are the causes? What recommendations, both short-term and long-term, would you make to solve the bottleneck problem?
The bottleneck area in the process is drying. There are about 19,000bbls go through the process (average 75bbls * 243 trucks). Among them, 13,330bbls are wet berries (70% of total processed berries), which should go through drying pro
to back a truck onto a dumper( 6 trucks/ hour) and they moved to five dumpers. So total dumps capacity is 75 (bbls/truck) X 6 (truck/hour) X 5 dumps = 2250
Second, temporary holding bins capacity :
1)Only dry berries bins (bins 1~16): 16 bins X 250bbls = 4000bbls
2)Wet of dry berries bins (bins 17~24): 8 bins X 250bbls = 2000bbls
3)Only wet berries (bins 25~27) : 3 bins X 400bbls = 1200bbls