Barrier Metal 증착
7. Si treatment; Contact 저항 등의 개선을 위한 표면 처리
8. Plasma Doping; Counter-doping, Shallow Junction 형성 등을 위한 이온 주입
⇒ 반도체 제조 공정의 50% 이상이 플라즈마를 활용한 공정임.
Electrostatic E-Field
Coupling of ion energy & ion flux
high pressure operation
low ion density (~1E9/cm3)
Inductive E-F
barrier). In this context, owing to their small size, customizable surface, improved solubility, targeted drug delivery and multifunctionality, nanoparticles have emerged as potential drug delivery carriers to tissues throughout the body. Yet passing the BBB is particularly difficult. The proper design of such engineered ‘nanocarriers’ becomes very important in transversing the impermeable me
barrier를 통과하는 방법이 반드시 존재해야 할 것이라고 추측할 수 있다. 그런데 그러한 분자들의 transport에 관한 핵심 열쇠는 위의 그림에서 볼 수 있는, 세포막 사이에 끼어있는 단백질들이 쥐고 있다. 이러한 단백질들은 다양한 기능을 하고 있는데, 그 중 대표적인 기능이 그들의 삼차구조에 따른 기
The camera is moving toward an Indian city. We are high and far away, only the sound of the wind as we grow nearer and nearer, and through the passing clouds these words appear:
No mans life can be encompassed in one telling. There is no way to give each year its allotted weight, to include each event, each person who helped to shape a lifetime. What can be done is to be faithful in spirit to the