(LED 패키지 내에서의 열전달)→(패키지에서 PCB로의 열전달)→(PCB에서 히트싱크로의 열전달)→(히트싱크 내에서의 열전달)→(히트싱크로 부터 외부 환경으로의 열전달)
-열전달(heat transfer)은 서로 다른 물질 간의 온도차에 의해 이루어짐
-열전달을 전도, 대류, 복사의 3가지 형
heat flux applications.
More total heat to remove than without a TEC.
▪ Mini contact : TEC – Silicon Chip
▪ Concentrating the TEC Power on a Small Area
▪ TEC with 20μm-thick Bi2Te3
▪ 10W
▪ 1250μm x 1250μm Copper Mini-contact Pad
Based on the use of SiGe/Si superlattice structures attached to silicon substrates, have received increasing
PAD - NIGHT 2-B *
On adjoining PADS, two other HELICOPTERS are VISIBLE; in
the b.g. can be SEEN several concrete and THATCHWORK
BUILDINGS, a secret command post disguised as a COASTAL
FISHING VILLAGE.
The post in a flurry of activity, AMERICAN ADVISORS
shouting directions to dozens of LATIN AMERICAN SOLDIERS
who stand by to assist the landing helicopter and to
load EQUIPMENT into the other choppe
PAD - NIGHT 2-B *
On adjoining PADS, two other HELICOPTERS are VISIBLE; in
the b.g. can be SEEN several concrete and THATCHWORK
BUILDINGS, a secret command post disguised as a COASTAL
FISHING VILLAGE.
The post in a flurry of activity, AMERICAN ADVISORS
shouting directions to dozens of LATIN AMERICAN SOLDIERS
who stand by to assist the landing helicopter and to
load EQUIPMENT into the other choppe