Able to dissipate limited amount of heat flux.
Lower coefficient of performance than vapor-compression systems.
Relegated to low heat flux applications.
More total heat to remove than without a TEC.
▪ Mini contact : TEC – Silicon Chip
▪ Concentrating the TEC Power on a Small Area
▪ TEC with 20μm-thick Bi2Te3
▪ 10W
▪ 1250μm x 1250μm Copper Mi