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분야
pptx2.Experimental procedure
3.Results & Discussion
4.Conclusion
5.Reference
Surface finish
Multiple Reflow
Distribution of stress at shear point
→ Shear Height ↑ = Contact Height ↑
→ Same Energy, Broaden Stress -> Stress per area decrease
[2] Intermetallic Reactions in Reflowed and Aged Sn-58Bi BGA Packages with Au/Ni/Cu Pads/ C.C. Chi, L.C. Tsao, C.W. Tsao, and T.H. Chuang)
[3]Effect of La addition on the interfacial intermetallics and bonding strengths of Sn–58Bi solder joints with Au/Ni/Cu pads / Yu-Yun Shiuea and Tung-Han Chuang
[4]리플로우 횟수와 표면처리에 따른 Sn-Ag-Cu계 무연 솔더 범프의 고속전단 특성평가 Effect of Reflow Number and Surface Finish on the High Speed Shear Properties of Sn-Ag-Cu Lead-free Solder Bump / 장임남, 박재현, 안용식
[5]BGA 솔더 접합부의 기계적·전기적 특성에 미치는 리플로우 횟수의 효과
Effect of Reflow Number on Mechanical and Electrical Properties of Ball Grid Array (BGA) Solder Joints / 구자명, 이창용, 정승부
[6] Proceedings Electronic Components and Technology Conference, Suhir, E. “"Could Shock Tests Adequately Mimic Drop Test Conditions,” (2002)
[7] K.C.Chang, K.N.Chiang, IEEE Transactions on Components and Packaging Technologies 27 (2004) 373-382
[8] G.E.Dieter, Mechanical Metallurgy, McGraw-Hill, New York, 1988m pp. 139-144, 295-301
[9] D,G,Kim J.W.Kim, J.G.Lee, H.Mori,D.j.Quesnel, S.B.Jung, Journal of Alloys and Compounds 395 (2005) 80-87
[10] Advanced Materials Science and Engineering, Inha University, A-Mi Yu, Jong-Hyun Lee, Nam-Hyun Kang, Hung-Han Kim, Mock-Sun Kim, "Solderability Evaluation and Reaction Properties of Sn-Ag-Cu Solders with Different Ag Content". (2006).
[11] JEDEC Standard JESD22-B 110-A, "Subassembly Mechanical Shock".(2004)
[12] JEDEC Standard JESD22-B104-C, "Mechanical Shock". (2004)
[13] JEDEC Standard JESD22-B117-A, “Ball shear test method". (2006)
[14] JEDEC Standard JESD22-A103-C, "High Temperature Storage Life". (2004)
