High-temperature decomposition
High-temperature splitting of water occurs at about 3000 °C. At this temperature, 10% of the water is decomposed and the remaining 90% can be recycled. To reduce the temperature, other processes for hightemperature splitting of water have been suggested:
▸Thermo-chemical cycles.
▸Hybrid systems coupling thermal decomposition and electrolytic
medium을 통해 처리하여 식품의 형태적 변형과 손상을 주지 않고 식품 저장성과 안정성을 높게함
② 원치 않는 병원성 미생물과 bio process작용, enzyme을 저해하여 식품의 질 향상
1. Pressure vessel(chamber) + its closure
2. Pressure generation system (pump)
3. Temperature control device
4. Fluid handling system
hightemperatures. For safety reasons, all activities in the RCA clean procedure should be performed in a Clean Station Work Area which is located under an exhaust fume hood.
[Figure 1] RCA cleaning
the RCA clean proceedure consists of the following steps
: Chemical Storage ⇒ Mix Organic Solution ⇒ Mix Ionic Solution ⇒ Mix HF Solution ⇒ Set-Up Bubbler Rinse
materials to be used in processing for CMOS devices
Process compatibility - for one, the film must survive sufficiently hightemperatures such as a Rapid thermal anneal to 1000 °C for say, 10 s (as dictated by the CMOS technological process)
Reliability
Stability against degradation by the electric field and injected carriers.
Precursor availability
Precursor and process costs
temperature transformation diagram): 온도, 시간, 변태곡선
3) 표면 경화법
① 화학적 표면 경화법
ⅰ) 침탄법: 고체(목탄, 코우크스), 가스(CO,CO2,메탄,에탄,프로판), 침탄깊이 0.5~2mm
ⅱ) 시안화법: KCN, NaCN (청화법)
ⅲ) 질화법: NH3, 50~100 Hr, 자동차의 크랭크축, 캠, 펌프축 등에 사용. 질화층 0.4~0.8mm
* 특징