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분야
pptDevelopment of devices
RC delay
Cross-talk
Required properties of low-κ dielectrics
Proposed materials
Organic/Inorganic hybrid
Organic
Porous Material
Preparing methods
CVD
Spin-on techniques
Conclusion
Capacitive crosstalk roughly proportional to kc=CIMD /CILD
⇒ Mainly fixed by the aspect ratio of lines and vias
⇒ Crosstalk level increases at each new generation
Induces delay uncertainty
A low-κ dielectric materials with a dielectric constant less than the dielectric constant of silicon dioxide, κ 1 GPa
Elastic modulus Nanoindentation > 6 GPa
Adhesion Tape pull, modified-edge lift-off Delamination-free
Disavantages
Weakens mechanical properties
Lower thermal conductivity
Narrow pore distribution to ensure dielectric constant is homogeneous and isotropic
Pores need to be closed cells to prevent crack propagation and moisture absorption
Need to add silica to seal surface pores
